§2208. Partial release of bond when planting deferred; payment in lieu of forfeiture
(REPEALED)
SECTION HISTORY
PL 1969, c. 472 (NEW). PL 1971, c. 618, §§13,17 (AMD). PL 1979, c. 466, §7 (RP).
§2208. Partial release of bond when planting deferred; payment in lieu of forfeiture
(REPEALED)
SECTION HISTORY
PL 1969, c. 472 (NEW). PL 1971, c. 618, §§13,17 (AMD). PL 1979, c. 466, §7 (RP).